技术档案

热压键合Thermocompression bonding

热与压力连接芯片

每条都摘自下方编号的来源原文；只写事实，不写预测或建议。

技术简介

原位热压键合在精确固定芯片的同时施加热和键合力，使焊料熔化并冷却形成互连，与整批回流工艺不同。2
Comparing the mass reflow process to an in-situ bonding process where the die is held in place accurately, bump to interconnect pad, while heat and bond force is dynamically applied until the solder is melted and cooled establishing the bonded interconnect.
ASMPT的AOR TCB是一种利用主动氧化物去除实现互连的无助焊剂热压键合工艺。3
This paper introduces ASMPT’s AOR TCB™ technology, a fluxless thermocompression bonding approach that uses active oxide removal to deliver clean, residue-free interconnects.

FIREBIRD热压键合平台已用于16层HBM堆栈的验证。1
Proven for 16-layer HBM stacks, the platform delivers 2.0 µm placement accuracy for fine-pitch, high-I/O-density applications.

ASMPT第三季度公告称，AI计算需求持续推动客户投资其热压键合方案。4
In logic, demand for AI computing continued to drive strong customer investment momentum across the Group’s TCB solutions.