技术档案
晶圆缺陷检测Wafer defect inspection
检测晶圆颗粒与图形缺陷
每条都摘自下方编号的来源原文；只写事实，不写预测或建议。
技术简介
- 晶圆缺陷检测与复检系统利用光子、电子束、传感器技术及AI算法，查找、识别和分类晶圆正面、背面及边缘的颗粒与图形缺陷。1
Patterned and unpatterned wafer defect inspection and review systems leverage unique photon and e-beam optical and sensor technologies and Al-driven algorithms to find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer.
主要参与者
- KLA提供缺陷检测与复检系统，用于芯片制造中的设备验证、晶圆验证、研发及设备、工艺和产线监控。1
KLA's defect inspection and review systems cover the full range of yield applications within the chip manufacturing environment, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring.