技术档案
超声芯片Ultrasound-on-Chip
以半导体替代压电晶体
每条都摘自下方编号的来源原文;只写事实,不写预测或建议。
已有应用
- Butterfly已将该技术用于第三代单探头全身便携超声设备Butterfly iQ3。1
Butterfly first proved its technology in the point-of-care ultrasound market – commercializing the world's first single-probe, whole-body portable ultrasound device, which is now on its best-selling, third-generation: Butterfly iQ3™.
- Butterfly iQ+和iQ3均采用超声芯片技术,以单个手持探头进行全身成像。2
Butterfly iQ+/iQ3 are both powered by our Ultrasound-on-Chip™ technology, allowing them to power whole-body imaging on a single handheld probe using digital semiconductor technology.
来源
- SEC · Document
- SEC · bfly-20251231 · 2026-02-27