技术档案

超声芯片Ultrasound-on-Chip

以半导体替代压电晶体

每条都摘自下方编号的来源原文;只写事实,不写预测或建议。

已有应用

  • Butterfly已将该技术用于第三代单探头全身便携超声设备Butterfly iQ3。1
    Butterfly first proved its technology in the point-of-care ultrasound market – commercializing the world's first single-probe, whole-body portable ultrasound device, which is now on its best-selling, third-generation: Butterfly iQ3™.
  • Butterfly iQ+和iQ3均采用超声芯片技术,以单个手持探头进行全身成像。2
    Butterfly iQ+/iQ3 are both powered by our Ultrasound-on-Chip™ technology, allowing them to power whole-body imaging on a single handheld probe using digital semiconductor technology.

来源

  1. SEC · Document
  2. SEC · bfly-20251231 · 2026-02-27