技术档案
热压键合Thermocompression bonding
热与压力连接芯片
每条都摘自下方编号的来源原文；只写事实，不写预测或建议。
未定事项
- ASMPT披露，存储器客户新设备采购决策的时间仍与HBM4产品推出进度紧密相连。1
In memory, the timing of customers’ new tool purchase decisions continued to be closely linked to HBM4 product rollout schedules, consistent with prior expectations.