技术档案

半导体晶圆清洗设备Semiconductor wafer cleaning equipment

去除晶圆表面污染物的设备

每条都摘自下方编号的来源原文；只写事实，不写预测或建议。

技术简介

  • 湿法清洗平台采用SAPS、TEBO和Tahoe技术，去除随机颗粒并保护晶圆的精细结构。2
    Our wet-cleaning platforms incorporate proprietary SAPS, TEBO, and Tahoe technologies, enabling effective removal of random particles while preserving delicate wafer features, even at increasingly advanced process nodes (the minimum line widths on a chip).

已有应用

  • Ultra C TEBO清洗设备采用Smart Megasonix技术控制空化，使边界层变薄。1
    The Ultra C TEBO™ tool uses Smart Megasonix™ to control the cavitation, enabling thinning of the boundary layer.

主要参与者

  • ACM Research开发了可在同一设备平台结合单片与批量工艺的模块化混合系统。1
    ACMR has developed a modular hybrid system wherein single wafer and batch processes can be combined on a single equipment platform.

来源

  1. acmr.com · Advanced Cleaning Solutions for 3D NAND and DRAM Devices · 2025-06-30
  2. SEC · acmr-20251231 · 2026-03-02