技术档案
半导体过程控制Semiconductor process control
芯片制造缺陷检测与量测
每条都摘自下方编号的来源原文；只写事实，不写预测或建议。
技术简介
- 图案及无图案晶圆缺陷检测与复查系统利用光子、电子束光学和传感器技术以及AI算法，发现、识别和分类晶圆表面、背面及边缘的颗粒与图案缺陷。1
Patterned and unpatterned wafer defect inspection and review systems leverage unique photon and e-beam optical and sensor technologies and Al-driven algorithms to find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer.
已有应用
- KLA的29xx和39xx光学宽带等离子体晶圆检测设备用于发现先进制程逻辑及存储器件的关键缺陷。1
The 29xx and 39xx optical broadband plasma wafer defect inspectors provide discovery of critical defects on advanced design node logic and memory devices.
为何此时
- KLA在2026年9月季度股东信中指出，半导体复杂性上升正在带来更严格的过程控制要求。2
The September quarter reflected continued strength in KLA’s leading market position in process control as growing semiconductor complexity drives more stringent requirements.
主要参与者
- KLA提供覆盖芯片制造中来料设备认证、晶圆认证、研发以及设备和产线监控的缺陷检测与复查系统。1
KLA's defect inspection and review systems cover the full range of yield applications within the chip manufacturing environment, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring.
相关卡片
- 2026-10-28芯片检测设备商科磊季度营收 41.4 亿美元，向股东返还 12.4 亿美元