技术档案
半导体检测与量测设备Semiconductor inspection and metrology equipment
检测芯片缺陷并测量尺寸
每条都摘自下方编号的来源原文；只写事实，不写预测或建议。
技术简介
- Micro-SR 可测量硅通孔、凸点及重布线层等结构的 X、Y 方向尺寸与高度。2
Additionally, the Micro-SR supports X, Y and height metrology for applications such as through-silicon vias (TSVs), bumps and redistribution layers (RDLs).
已有应用
- Micro-SR 在 CIRCL-AP 系统中作为晶圆正面缺陷复检与量测模块。2
The Micro-SR™ serves as a wafer frontside defect review and metrology module on the CIRCL-AP system.
主要参与者
- KLA 提供用于晶圆、掩模、集成电路、封装及印刷电路板制造的过程控制与工艺使能解决方案。1
We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging and printed circuit boards.