技术档案

半导体刻蚀设备Semiconductor etch equipment

去除晶圆材料的设备

每条都摘自下方编号的来源原文；只写事实，不写预测或建议。

技术简介

刻蚀通过选择性去除晶圆上已沉积的薄膜和材料来形成芯片结构。3
Etch processes help create chip features by selectively removing films and materials that have been deposited on the wafer.

已有应用

Tactras 是300毫米晶圆等离子刻蚀系统。2
Tactras™ is a highly reliable 300mm plasma etch system that enhances etch process productivity.
Coronus刻蚀产品去除晶圆边缘残留物，Coronus沉积产品保护晶圆边缘免受损伤。3
Coronus etch products remove bevel residues and Coronus deposition protect the wafer bevel from damage.

为何此时

东京电子2026年10月财报称，数据中心AI服务器需求扩大推动其预期全年销售与利润增长。4
Compared with the previous fiscal year, both net sales and profit are expected to increase, reflecting expanding demand for AI servers for data centers.

主要参与者

东京电子的Tactras系列采用等离子刻蚀技术和矩形集群设计。2
Tactras™ is a series of pioneering plasma etch systems featuring a space-saving rectangular cluster design.

未定事项

交替进行刻蚀与沉积会产生波纹，减小波纹尺寸会牺牲经济制造所需的生产效率。1
Scallop size can be decreased, but at the expense of productivity needed for cost-efficient manufacturing.

相关卡片

2026-10-30东京电子向股东付股息 1660.41 亿日元，并回购股票、购置固定资产

来源