技术档案
半导体封装测试Semiconductor assembly and test
芯片封装与功能测试
每条都摘自下方编号的来源原文；只写事实，不写预测或建议。
技术简介
- 封装测试将新制成的处理器安装在基板上，与其他处理器连接并检查错误。1
There, newly built processors are mounted to underlying substrates, connected to other processors, and checked for errors.
已有应用
- Teradyne的UltraFLEXplus与东京电子的Prexa SDP构成用于先进封装流程中器件筛选的测试方案。2
The solution pairs Teradyne’s UltraFLEXplus platform with TEL’s Prexa™ SDP to provide fabless designers, foundries, and OSATs a production-ready path to high-quality device screening at multiple points in the advanced packaging flow.
为何此时
- AI和数据中心芯片采用多裸片2.5D或3D封装时，一颗有缺陷的裸片可能损害整个高价值封装。2
As AI and data center device architectures increasingly adopt chiplet-based designs that integrate multiple die into a single 2.5D or 3D package, a single defective die can compromise the entire high-value package.
主要参与者
- AMD称日月光是全球最大的外包半导体封装测试企业。1
ASE Technology Holdings is the largest OSAT in the world, with facilities in Taiwan, China, Japan, Korea, Malaysia, and Singapore.