技术档案

半导体封装测试Semiconductor assembly and test

芯片封装与功能测试

每条都摘自下方编号的来源原文；只写事实，不写预测或建议。

已有应用

  • 泰瑞达UltraFLEXplus与东京电子Prexa SDP组成先进封装流程中的裸片筛选测试方案。1
    The solution pairs Teradyne’s UltraFLEXplus platform with TEL’s Prexa™ SDP (Singulated Device Prober) to provide fabless designers, foundries, and OSATs a production-ready path to high-quality device screening at multiple points in the advanced packaging flow.

来源

  1. investors.teradyne.com · Teradyne Introduces Integrated Test Solution for AI and Data Center Devices in Collaboration with Tokyo Electron · 2026-06-08