技术档案
等离子体刻蚀设备Plasma etching equipment
用等离子体去除薄膜
每条都摘自下方编号的来源原文；只写事实，不写预测或建议。
已有应用
- 中微公司的Primo Twin-Star是采用电感耦合等离子体技术的300毫米刻蚀设备。1
The Primo Twin-Star ® system is AMEC’s advanced 300mm etch product based on Inductively Coupled Plasma (ICP) technology.
用等离子体去除薄膜
每条都摘自下方编号的来源原文；只写事实，不写预测或建议。
The Primo Twin-Star ® system is AMEC’s advanced 300mm etch product based on Inductively Coupled Plasma (ICP) technology.