技术档案

NAND 闪存制造设备NAND flash manufacturing equipment

制造NAND闪存的设备

每条都摘自下方编号的来源原文;只写事实,不写预测或建议。

技术简介

  • NAND闪存制造中的刻蚀工艺需要穿透数十层交替材料,形成沟道。2
    Going vertical in NAND meant etching channels through dozens of alternating material layers with extraordinary precision.

已有应用

  • 泛林ALTUS Halo系统用于3D NAND高深宽比字线的钼填充,以钼替代钨。2
    Our ALTUS® Halo system, for example, delivers void-free molybdenum fill for the high-aspect-ratio wordlines that 3D NAND requires, replacing tungsten at a point when resistance had become a limiting factor for device performance.

主要参与者

  • 据路透社报道,大连NAND工厂使用泛林、应用材料和科磊的设备。1
    The Dalian NAND facility uses tools from major US semiconductor equipment makers like Lam Research, Applied Materials and KLA.

来源

  1. investing.com · Exclusive-SK Hynix conditions new US factory on more US chip equipment exports to China, sources say  By Reuters · 2026-10-15
  2. 泛林 · Learning From NAND: What the 3D Transition Teaches Us About DRAM’s Next Decade · 2026-04-02