技术档案
异构集成先进封装Heterogeneous Integration Advanced Packaging
多芯粒集成封装
每条都摘自下方编号的来源原文；只写事实，不写预测或建议。
技术简介
- 先进封装将多颗芯片或芯粒集成到单一高密度封装中。1
Advanced packaging enables the integration of multiple chips—or chiplets—into a single, high-density package, creating tighter integration, higher bandwidth, and improved power delivery.
已有应用
- 日月光已用由两个相同扇出模块组成的85mm×85mm测试载体展示FOCoS-Bridge进展。2
Progress has been demonstrated using an 85mm x 85mm test vehicle comprised of two identical fan-out modules.
为何此时
- 日月光2025年5月指出，AI和HPC供电需求日益复杂，需要具备TSV的先进桥接芯片。2
AI and HPC power delivery requirements are becoming more complex and now necessitate advanced bridge chips with TSV features.
主要参与者
- 日月光的VIPack是面向AI、HPC及数据中心系统架构的垂直集成封装平台。1
VIPack™ is a vertically integrated packaging platform designed to enable next-generation system architectures for AI, HPC, and data-center infrastructure.
- 日月光推出VIPack，为客户提供先进封装方案组合。1
As the world’s leading OSAT, ASE introduced VIPack™ to provide customers with a flexible and comprehensive portfolio of advanced packaging solutions tailored to the most demanding applications.