技术档案
HBM4HBM4
第六代堆叠高带宽内存
每条都摘自下方编号的来源原文;只写事实,不写预测或建议。
技术简介
- HBM用于AI处理器旁处理大量数据。4
HBM, or high-bandwidth memory, is a type of advanced memory used alongside AI processors to handle large amounts of data.
- 高带宽内存的先进封装将多层内存芯片垂直堆叠,缩小占地。5
This sophisticated process involves vertically stacking multiple layers of memory chips on a smaller footprint to reach higher computational performance and energy efficiency.
- 三星HBM4以12层堆叠提供24GB至36GB容量。2
Through 12-layer stacking technology, Samsung offers HBM4 in capacities ranging from 24 gigabytes (GB) to 36GB.
- 三星HBM4每堆叠带宽最高3.3TB/s,较HBM3E提高至2.7倍。2
Also, total memory bandwidth per single stack is increased by 2.7x compared to HBM3E, to a maximum of 3.3 terabytes-per-second (TB/s).
- HBM4是HBM3E的后继,三星称其11.7Gbps引脚速度为HBM3E最高9.6Gbps的1.22倍。2
This represents a 1.22x increase over the maximum pin speed of 9.6Gbps of its predecessor, HBM3E.
已有应用
- 三星已开始为英伟达Vera Rubin平台批量销售HBM4及SOCAMM2。3
This included initiating the industry’s first mass product sales of HBM4 and SOCAMM2 for NVIDIA’s Vera Rubin platform, as well as the timely development of PCIe Gen6 SSDs.
- 三星已量产的第六代HBM4面向英伟达Vera Rubin平台设计。1
The centerpiece of Samsung’s showcase at NVIDIA GTC 2026 will be the new sixth-generation HBM4, which is now in mass production and is designed for the NVIDIA Vera Rubin platform.
为何此时
- 三星2026年第三季度显著扩大HBM4销售,并应对服务器SSD需求增长。6
It significantly scaled up sales of HBM4 on the back of industry-leading product competitiveness while proactively addressing growing demand for server SSDs.
- 三星三季度内存业务受到产能约束,服务器强劲需求推高各应用市场价格。6
Strong demand momentum for servers led to higher market prices across all applications.
- SK海力士2026年第三季度HBM4出货开始放量,同时服务器DDR5销售明显增长。7
By product, DRAM results were driven by a significant increase in sales of server DDR5 while HBM4 shipments began in earnest.
主要参与者
- 三星第六代HBM4已进入量产。1
The centerpiece of Samsung’s showcase at NVIDIA GTC 2026 will be the new sixth-generation HBM4, which is now in mass production and is designed for the NVIDIA Vera Rubin platform.
- 三星电子于2026年2月12日宣布已量产HBM4并向客户出货商业产品。2
Samsung Electronics, a global leader in advanced memory technology, today announced that it has begun mass production of its industry-leading HBM4 and has shipped commercial products to customers.
相关卡片
- 2026-10-27SK 海力士定下全年向股东返还约 100 万亿韩元,含铠侠投资收益
来源
- news.samsung.com · Samsung Unveils HBM4E, Showcasing Comprehensive AI Solutions, NVIDIA Partnership and Vision at NVIDIA GTC 2026 – Samsung Global Newsroom · 2026-03-16
- news.samsung.com · Samsung Ships Industry-First Commercial HBM4 With Ultimate Performance for AI Computing – Samsung Global Newsroom · 2026-02-12
- news.samsung.com · Samsung Electronics Announces First Quarter 2026 Results – Samsung Global Newsroom · 2026-04-29
- CNBC · SK Hynix shares soar over 8% as profit beats, chipmaker to return $25 billion to investors · 2026-10-27
- airliquide.com · Air Liquide invests over 170M USD in the U.S. to support SK hynix’s ambition to build a global AI memory ecosystem | Air Liquide · 2026-07-01
- news.samsung.com · Samsung Electronics Announces Third Quarter 2026 Results – Samsung Global Newsroom · 2026-10-29
- prnewswire.com · SK hynix Announces 3Q26 Financial Results · 2026-10-27