技术档案
DUV多重图形化DUV multi-patterning
深紫外多重曝光造芯
每条都摘自下方编号的来源原文；只写事实，不写预测或建议。
技术简介
- DUV浸没式多重图形化比EUV更复杂；EUV可简化客户制造流程。2
Compared to complex multiple-patterning strategies using deep ultraviolet (DUV) immersion systems, EUV systems help simplify our customers’ manufacturing processes.
已有应用
- 据TechInsights拆解，华为Mate 80系列的麒麟9030由中芯国际用改进的7纳米工艺制造。3
Dec 12 (Reuters) - The Kirin 9030, the chip that powers Huawei Technologies' latest flagship Mate 80 series handset, has been manufactured by China's top foundry SMIC (0981.HK), opens new tab with an improved version of 7 nanometres, which is still behind TSMC and Samsung, Canadian research firm TechInsights said.
主要参与者
- ASML的浸没式光刻系统适用于单次曝光及多重图形化，也可与EUV配合制造同一芯片的不同层。2
Our immersion systems are suitable for both single-exposure and multiple-patterning lithography, and can be used in seamless combination with EUV systems to print different layers on the same chip.
- 英国金融时报报道，中芯国际测试国产28纳米DUV光刻机，并利用多重图形化制造7纳米芯片。1
SMIC was testing a 28 nanometre Chinese-made DUV lithography machine and then utilising so-called multi-patterning techniques to produce 7nm chips, said two people with knowledge of the development.
未定事项
- 2025年9月金融时报报道，中芯国际国产设备试验早期结果良好，但何时可量产仍不清楚。1
While early results from the SMIC trial are promising, it remained unclear if and when the machine can be used for mass chip production, one of the people said.