技术档案
直接液冷Direct Liquid Cooling
用液体和冷板移走芯片热量
每条都摘自下方编号的来源原文;只写事实,不写预测或建议。
已有应用
- atNorth的DEN01数据中心可容纳直接液冷,以支持HPC和AI负载。1
DEN01 also accommodates Direct Liquid Cooling (DLC) technology, providing dense, concentrated cooling to targeted areas to support HPC and AI workloads in an energy efficient way.