技术档案

CoWoS先进封装Chip on Wafer on Substrate

逻辑与内存集成封装

每条都摘自下方编号的来源原文；只写事实，不写预测或建议。

技术简介

  • CoWoS-S用大面积硅中介层上的高密度互连连接逻辑芯粒与HBM。1
    Wafer-level system integration provides high-density interconnects and embedded deep trench capacitors over a large silicon interposer area to accommodate various functional top dies, including logic chiplets, with high-bandwidth memory (HBM) cubes stacked over it.

来源

  1. 3dfabric.tsmc.com · CoWoS® - Taiwan Semiconductor Manufacturing Company Limited