技术档案
半导体封装与测试
每条都摘自下方编号的来源原文；只写事实，不写预测或建议。
技术简介
- 晶圆经过制造后，处理器在封测厂安装到基板、连接其他处理器并检查错误。1
There, newly built processors are mounted to underlying substrates, connected to other processors, and checked for errors.
已有应用
- 日月光VIPack平台包含FOPoP、FOCoS、FOCoS-Bridge、FOSiP，以及基于TSV的2.5D和3D IC及共封装光学能力。2
VIPack™ includes ASE’s high-density RDL-based Fan-Out Package-on-Package (FOPoP), Fan-Out Chip-on-Substrate (FOCoS), Fan-Out Chip-on-Substrate-Bridge (FOCoS-Bridge), and Fan-Out System-in-Package (FOSiP), as well as TSV-based 2.5D and 3D IC and co-packaged optics capabilities.
主要参与者
- 日月光为半导体厂商提供组装测试，并自2007年与AMD合作开发2.5D中介层及其他先进封装。1
It assembles and tests electronics for semiconductor manufacturers across the planet and has collaborated with AMD to develop 2.5D interposers and other advanced packaging since 2007.