技术档案
先进封装Advanced semiconductor packaging
芯片互连与封装
每条都摘自下方编号的来源原文；只写事实，不写预测或建议。
技术简介
- 在外包封装测试厂，新制成的处理器被安装到底层基板、连接其他处理器并进行错误检测。1
There, newly built processors are mounted to underlying substrates, connected to other processors, and checked for errors.
芯片互连与封装
每条都摘自下方编号的来源原文；只写事实，不写预测或建议。
There, newly built processors are mounted to underlying substrates, connected to other processors, and checked for errors.