技术档案
先进封装Advanced semiconductor packaging
芯片互连与封装
每条都摘自下方编号的来源原文；只写事实，不写预测或建议。
技术简介
- 日月光的面板级封装以矩形面板替代传统圆形晶圆，每块面板可用面积最高为96,100平方毫米。1
By transitioning from traditional round wafers to rectangular panels, ASE enables significantly greater usable area—up to 96,100 mm² per panel—allowing for more dies per unit and improved material efficiency.