技术档案
先进封装Advanced semiconductor packaging
芯片互连与封装
每条都摘自下方编号的来源原文；只写事实，不写预测或建议。
为何此时
- 日月光2026年5月的公告称，面板级封装针对中介层尺寸增加、晶圆级加工效率下降的问题。1
This shift to panel-level packaging addresses critical industry challenges, including rising interposer sizes and declining wafer-level efficiency.
主要参与者
- 日月光提供半导体封装和测试服务，并于2026年5月公布开发自动化310毫米面板级封装产线。1
SUNNYVALE, Calif., May 26, 2026 – Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) and a leading provider of semiconductor assembly and test services, today announced the development of an industry-first automated 310mm × 310mm panel-level packaging production line, advancing its leadership in next-generation advanced packaging technologies.