技术档案
先进封装Advanced packaging
多芯片高密度封装
每条都摘自下方编号的来源原文；只写事实，不写预测或建议。
技术简介
- VIPack是日月光面向AI、高性能计算和数据中心系统架构的垂直整合封装平台。1
VIPack™ is a vertically integrated packaging platform designed to enable next-generation system architectures for AI, HPC, and data-center infrastructure.
已有应用
- 日月光VIPack平台包含FOPoP、FOCoS、FOCoS-Bridge、FOSiP、基于TSV的2.5D与3D IC及共封装光学能力。1
VIPack™ includes ASE’s high-density RDL-based Fan-Out Package-on-Package (FOPoP), Fan-Out Chip-on-Substrate (FOCoS), Fan-Out Chip-on-Substrate-Bridge (FOCoS-Bridge), and Fan-Out System-in-Package (FOSiP), as well as TSV-based 2.5D and 3D IC and co-packaged optics capabilities.
主要参与者
- 日月光已推出面向客户先进封装需求的VIPack平台。1
As the world’s leading OSAT, ASE introduced VIPack™ to provide customers with a flexible and comprehensive portfolio of advanced packaging solutions tailored to the most demanding applications.