技术档案

先进封装Advanced packaging

多芯片系统级整合

每条都摘自下方编号的来源原文；只写事实，不写预测或建议。

为何此时

  • 2026年6月的测试设备公告指出，多芯粒2.5D或3D封装中，单颗缺陷芯粒就可能损害整个高价值封装。1
    As AI and data center device architectures increasingly adopt chiplet-based designs that integrate multiple die into a single 2.5D or 3D package, a single defective die can compromise the entire high-value package.

来源

  1. investors.teradyne.com · Teradyne Introduces Integrated Test Solution for AI and Data Center Devices in Collaboration with Tokyo Electron · 2026-06-08