技术档案

先进封装Advanced packaging

将多个芯片集成于同一封装

每条都摘自下方编号的来源原文；只写事实，不写预测或建议。

技术简介

现代AI服务器芯片通过将多个裸片集成到单个封装中，容纳数万亿个晶体管。2
Modern AI server chips pack trillions of transistors by integrating multiple dies into a single package.

已有应用

HBM采用堆叠DRAM芯片并用硅通孔连接的先进封装方式。2
HBM is a leading example of this approach, stacking DRAM chips on top of one another and connecting them with through-silicon vias (TSVs).

为何此时

下一代HBM需要越来越多高纯气体，液化空气将向SK海力士新先进封装厂供应氮、氧、氩、氢等工业气体。3
As next-generation memory chips, such as High Bandwidth Memory (HBM), require ever-increasing quantities of high-purity gases, Air Liquide will deliver large volumes of nitrogen, oxygen, argon, hydrogen and other industrial gases to SK hynix’s new cutting-edge advanced chips packaging facility.

主要参与者

SK海力士韩国生产的晶圆将运往印第安纳进行先进封装和测试。1
Cutting-edge wafers produced by SK hynix in Korea will be sent to Indiana for advanced packaging and testing before reaching U.S. customers.

来源