技术档案

先进封装Advanced packaging

多芯片高密度集成封装

每条都摘自下方编号的来源原文；只写事实，不写预测或建议。

未定事项

  • 日月光指出，共封装光学面临带宽密度不匹配、复杂组装及精确光纤对准等挑战。1
    Co-Packaged Optics (CPO) offers substantial potential for enhancing the interconnection efficiency in this architecture, but it also faces challenges such as bandwidth density mismatches, complex assembly, and precise fiber alignment.

来源

  1. ase.aseglobal.com · Blog · 2026-02-12