技术档案
先进封装Advanced packaging
多芯片系统集成封装
每条都摘自下方编号的来源原文；只写事实，不写预测或建议。
技术简介
- 先进封装把多个芯片集成到一个系统中。2
By integrating multiple chips into a single, high-performance system, advanced packaging delivers the density, efficiency, and scalability required for next-generation AI and data-center architectures.
已有应用
- 日月光VIPack是面向AI、高性能计算和数据中心架构的垂直集成封装平台。1
VIPack™ is a vertically integrated packaging platform designed to enable next-generation system architectures for AI, HPC, and data-center infrastructure.
主要参与者
- 日月光推出了先进封装平台VIPack。1
As the world’s leading OSAT, ASE introduced VIPack™ to provide customers with a flexible and comprehensive portfolio of advanced packaging solutions tailored to the most demanding applications.