技术档案
先進封裝Advanced packaging
多晶片高密度整合封裝
每条都摘自下方编号的来源原文；只写事实，不写预测或建议。
技术简介
- 先進封裝將多顆晶片或小晶片整合進單一高密度封裝，以提高整合密度、頻寬與供電能力。3
Advanced packaging enables the integration of multiple chips—or chiplets—into a single, high-density package, creating tighter integration, higher bandwidth, and improved power delivery.
已有应用
- NVIDIA Vera Rubin平台中的Spectrum-X Ethernet Photonics交換器採用共封裝光學，已進入生產。2
Vera Rubin introduces NVIDIA Spectrum-X Ethernet Photonics — now in production — combining co-packaged optics with Spectrum-X switching to enable million-GPU AI factories.
主要参与者
- 矽品提供半導體封裝與測試服務。1
Siliconware Precision Industries Co., Ltd. (SPIL) is a leading provider of semiconductor packaging and testing services.