技术档案

先进封装Advanced packaging

多芯片高密度集成封装

每条都摘自下方编号的来源原文；只写事实，不写预测或建议。

已有应用

  • 日月光VIPack平台包含FOPoP、FOCoS、FOCoS-Bridge、FOSiP、TSV型2.5D及3D IC与共封装光学能力。1
    VIPack™ includes ASE’s high-density RDL-based Fan-Out Package-on-Package (FOPoP), Fan-Out Chip-on-Substrate (FOCoS), Fan-Out Chip-on-Substrate-Bridge (FOCoS-Bridge), and Fan-Out System-in-Package (FOSiP), as well as TSV-based 2.5D and 3D IC and co-packaged optics capabilities.

来源

  1. ase.aseglobal.com · Blog