技术档案
先进封装Advanced packaging
将多个芯片集成于同一封装
每条都摘自下方编号的来源原文；只写事实，不写预测或建议。
已有应用
- HBM采用堆叠DRAM芯片并以硅通孔连接的封装方式。1
HBM is a leading example of this approach, stacking DRAM chips on top of one another and connecting them with through-silicon vias (TSVs).
将多个芯片集成于同一封装
每条都摘自下方编号的来源原文；只写事实，不写预测或建议。
HBM is a leading example of this approach, stacking DRAM chips on top of one another and connecting them with through-silicon vias (TSVs).