技术档案
先进制程芯片制造Advanced-node semiconductor manufacturing
制造微缩逻辑芯片
每条都摘自下方编号的来源原文；只写事实，不写预测或建议。
已有应用
- 英伟达2025年10月17日宣布，台积电凤凰城工厂制造的美国首片Blackwell晶圆标志着该产品进入量产。1
NVIDIA founder and CEO Jensen Huang today visited TSMC’s semiconductor manufacturing facility in Phoenix to celebrate the first NVIDIA Blackwell wafer produced on U.S. soil, representing that Blackwell has reached volume production.
为何此时
- 台积电在2026年7月宣布拟增建2纳米及以下逻辑晶圆厂和先进封装厂，以支持美国客户需求。2
In July 2026, the company announced intent to build several more semiconductor logic wafer fabs for 2-nanometer and below technologies, as well as advanced packaging fabs, to support strong US customer demand.
主要参与者
- 台积电亚利桑那厂制造的先进技术涵盖2、3、4纳米和A16芯片。1
TSMC Arizona will produce advanced technologies including two-, three- and four-nanometer chips, as well as A16 chips, all essential for applications like AI, telecommunications and high-performance computing.