技术档案

先进芯片封装Advanced chip packaging

多芯片高密度集成封装

每条都摘自下方编号的来源原文；只写事实，不写预测或建议。

技术简介

  • 先进封装把多个芯片或芯粒集成到单个高密度封装中。1
    Advanced packaging enables the integration of multiple chips—or chiplets—into a single, high-density package, creating tighter integration, higher bandwidth, and improved power delivery.

主要参与者

  • 日月光推出 VIPack，提供面向高要求应用的先进封装解决方案组合。1
    As the world’s leading OSAT, ASE introduced VIPack™ to provide customers with a flexible and comprehensive portfolio of advanced packaging solutions tailored to the most demanding applications.

来源

  1. ase.aseglobal.com · Blog · 2025-12-19