技术档案
8英寸晶圆代工8-inch wafer foundry
用8英寸晶圆代工芯片
每条都摘自下方编号的来源原文；只写事实，不写预测或建议。
技术简介
- 三星的8英寸晶圆代工采用65、70、90、130和180纳米等成熟制程。1
Samsung Electronics’ 8-inch foundry operations use mature process technologies, including 65-nanometer, 70-nanometer, 90-nanometer, 130-nanometer and 180-nanometer nodes.
未定事项
- 现有产品转用12英寸晶圆先进制程可能增加制造成本，并需要重新设计和认证。1
Switching to advanced processes using 12-inch wafers could increase manufacturing costs and require redesigning and requalifying existing products.